{"id":32,"date":"2025-07-16T17:06:13","date_gmt":"2025-07-16T15:06:13","guid":{"rendered":"https:\/\/quintenz.de\/?page_id=32"},"modified":"2025-07-29T21:41:29","modified_gmt":"2025-07-29T19:41:29","slug":"fertigung","status":"publish","type":"page","link":"https:\/\/quintenz.de\/en\/dienstleistungen\/fertigung\/","title":{"rendered":"Production"},"content":{"rendered":"
\n

Hybridtechnik Fertigung<\/h1>\n\n\n\n
\n

Thinfilm Hybrids<\/h3>\n\n\n\n
\n

Substrate Materials:<\/p>\n\n\n\n

    \n
  • Ceramics AI2O3, AIN<\/li>\n\n\n\n
  • Glass, Quartz and Fused Silica, Sapphire<\/li>\n\n\n\n
  • Si, SiC, others on request<\/li>\n<\/ul>\n\n\n\n

    Layer Systems:<\/p>\n\n\n\n

      \n
    • Different CrNi\/Au-systems , e.g. CrNi\/W\/Ti\/Pd\/Au<\/li>\n\n\n\n
    • Cu basierte Schichtsysteme<\/li>\n\n\n\n
    • Weitere Schichtsysteme und Ausf\u00fchrungen auf Anfrage.<\/li>\n<\/ul>\n\n\n\n

      Resistors:<\/p>\n\n\n\n

        \n
      • CrNi-substrate resistors (integrated) with surface resistivities from 10?\/? to 300?\/?<\/li>\n\n\n\n
      • <25ppm\/K, trim to 0.01%<\/li>\n\n\n\n
      • Chip resistors (dice) from 0.1?-100G?<\/li>\n\n\n\n
      • Standard resistors (glued or soldered)<\/li>\n<\/ul>\n\n\n\n

        Suitable for:<\/p>\n\n\n\n

          \n
        • Soldering techniques<\/li>\n\n\n\n
        • Gluing techniques<\/li>\n\n\n\n
        • Bonding (Al and Au)<\/li>\n<\/ul>\n<\/div>\n\n\n\n
          \"D\u00fcnnschichtplatine<\/figure>\n<\/div>\n\n\n\n
          \n

          Thickfilm Hybrids<\/h3>\n\n\n\n
          \n

          Substrate Materials:<\/p>\n\n\n\n

            \n
          • Ceramics AI2O3 (4in x 4in)<\/li>\n\n\n\n
          • Ceramics AIN (2in x 2in)<\/li>\n<\/ul>\n\n\n\n

            Layer Systems:<\/p>\n\n\n\n

              \n
            • PdAg, Au, Ag, PtAg<\/li>\n\n\n\n
            • min. 80\u00b5m (3.15mil) distance, min. 100\u00b5m (4mil) width<\/li>\n<\/ul>\n\n\n\n

              Resistors:<\/p>\n\n\n\n

                \n
              • Thickfilm resistors (integrated), trim down to 0.1%<\/li>\n\n\n\n
              • Chip resistors (dice) from 0.1? - 100G?<\/li>\n\n\n\n
              • Standard resistors (glued or soldered)<\/li>\n<\/ul>\n\n\n\n

                Suitable for:<\/p>\n\n\n\n

                  \n
                • Soldering techniques<\/li>\n\n\n\n
                • Gluing techniques<\/li>\n\n\n\n
                • Bonding (Al and Au)<\/li>\n<\/ul>\n<\/div>\n\n\n\n
                  \"Dickschichtplatine<\/figure>\n<\/div>\n\n\n\n
                  \n

                  Chip On Board (COB)<\/h3>\n\n\n\n

                  COB technology on PCB and Flex materials. Other base materials on request.<\/p>\n<\/div>\n\n\n\n

                  \n

                  Assembly<\/h3>\n\n\n\n
                  \n

                  Assembly - Placement:<\/p>\n\n\n\n

                    \n
                  • All standard components<\/li>\n\n\n\n
                  • Dice, unpackaged components\/semiconductors<\/li>\n\n\n\n
                  • Precision mounting of optical components (CCD, LED, sensor etc.)<\/li>\n<\/ul>\n\n\n\n

                    Assembly of Modules and Appliances:<\/p>\n\n\n\n

                      \n
                    • Assembly of modules and appliances by commissioned production<\/li>\n\n\n\n
                    • Manufacturing and test of optical modules and appliances<\/li>\n<\/ul>\n<\/div>\n<\/div>\n\n\n\n
                      \n

                      Documentation<\/h3>\n\n\n\n
                      \n

                      Documentation and security rules are enforced on a high level:<\/p>\n\n\n\n

                        \n
                      • 100% traceability<\/li>\n\n\n\n
                      • detailed test documentation<\/li>\n<\/ul>\n<\/div>\n<\/div>\n\n\n\n
                        \n

                        Packaging<\/h3>\n\n\n\n

                        Packaging of Hybrids and Printed Circuit Boards, Packages for special applications, MEMS-Packaging, Packaging of optical components<\/p>\n<\/div>\n<\/article>","protected":false},"excerpt":{"rendered":"

                        Hybridtechnik Fertigung D\u00fcnnschichthybride Substratmaterialien Schichtaufbau: Widerst\u00e4nde: geeignet f\u00fcr: Dickschichthybride Substratmaterialien: Schichtaufbau: Widerst\u00e4nde: geeignet f\u00fcr: Chip On Board (COB) COB Technologie auf Standard-PCB und Flex (Polymer). Andere Basismaterialien auf Anfrage. Best\u00fcckung & Montage Best\u00fcckung: Modul- und Ger\u00e4temontage: Dokumentation Dokumentations- und Sicherheitsrichtlinien werden auf h\u00f6chstem Niveau umgesetzt: Packaging Geh\u00e4usung von Hybriden und PCB-Schaltungstr\u00e4gern, Spezialgeh\u00e4use, MEMS-Packaging, Opto-Komponenten<\/p>","protected":false},"author":1,"featured_media":138,"parent":28,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-32","page","type-page","status-publish","has-post-thumbnail","hentry"],"_links":{"self":[{"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/pages\/32","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/comments?post=32"}],"version-history":[{"count":12,"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/pages\/32\/revisions"}],"predecessor-version":[{"id":690,"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/pages\/32\/revisions\/690"}],"up":[{"embeddable":true,"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/pages\/28"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/media\/138"}],"wp:attachment":[{"href":"https:\/\/quintenz.de\/en\/wp-json\/wp\/v2\/media?parent=32"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}