DevelopmentCircuit Design / Circuit Analysis, CAD / Layout, national and international research projects
Production TestTest Specifications, Test Adapters and Appliances, 100% Production Testing to MIL Standards, Test Documentation
ProductionThinfilm Hybrids, Thickfilm Hybrids, Chip on Board (COB), Assembly, Documentation, Packaging
ObsolescenceContinuance of units, designs and production flows where highest reliability and lifetime matters
Packaginghermetically sealed metal packages, standard TO-packages, also as commissioned