Hybridtechnik Fertigung

Substrate Materials:

• Ceramics AI2O3, AIN
• Glass, Quartz and Fused Silica, Sapphire
• Si, SiC, others on request

Layer Systems:

• Different CrNi/Au-systems , e.g. CrNi/W/Ti/Pd/Au
• Cu basierte Schichtsysteme
• Weitere Schichtsysteme und Ausführungen auf Anfrage.

Resistors:

• CrNi-substrate resistors (integrated) with surface resistivities from 10?/? to 300?/?
• <25ppm/K, trim to 0.01%
• Chip resistors (dice) from 0.1?-100G?
• Standard resistors (glued or soldered)

Suitable for:

• Soldering techniques
• Gluing techniques
• Bonding (Al and Au)

Substrate Materials:

• Ceramics AI2O3 (4in x 4in)
• Ceramics AIN (2in x 2in)

Layer Systems:

• PdAg, Au, Ag, PtAg
• min. 80µm (3.15mil) distance, min. 100µm (4mil) width

Resistors:

• Thickfilm resistors (integrated), trim down to 0.1%
• Chip resistors (dice) from 0.1? - 100G?
• Standard resistors (glued or soldered)

Suitable for:

• Soldering techniques
• Gluing techniques
• Bonding (Al and Au)

Assembly - Placement:

• All standard components
• Dice, unpackaged components/semiconductors
• Precision mounting of optical components (CCD, LED, sensor etc.)

Assembly of Modules and Appliances:

• Assembly of modules and appliances by commissioned production
• Manufacturing and test of optical modules and appliances

Documentation and security rules are enforced on a high level:

• 100% traceability
• detailed test documentation